In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.

DIPs may be used for integrated circuits (ICs, "chips"), like microprocessors, or for arrays of discrete components such as resistors or toggle switches. They can be mounted on a printed circuit board (PCB) either directly using through-hole technology, or using inexpensive sockets to allow for easy replacement of the device and to reduce the risk of overheat damage during soldering.